The new Ceramos generation no longer has the conventional ceramic package and bond wiring of its predecessors. Instead it utilizes a CSP platform (chip sized package) specially developed by Osram Opto Semiconductors. This ensures that the entire chip surface is uniformly illuminated and that there is virtually no loss of light. Also Ceramos C has a smaller footprint: Measuring just 1.4 mm x 1.4 mm x 0.21 mm, it is three times shallower than its predecessor but produces the same brightness despite its smaller package size. This gives designers greater freedom. Ceramos C is suitable for use in smartphones or tablets that need a compact LED particularly for the front camera, but also for the main flash and for the flashlight function.